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| Benefits |
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Offered in three standard chip sizes — 0603, 0805, and 1206 |
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Short reaction times of ≤ 5 s (in air) |
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Outstanding stability of temperature characteristic of > ±0.04 % over a wide temperature range of −55°C up to +155°C |
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Feature B and 2B tolerance classes |
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Offer resistance values of 100 Ω, 500 Ω, and 1 kΩ, with other values available on request |
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Special coating protects against electrical, mechanical, and climatic impacts |
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Pure tin on nickel plating terminations |
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Proven immunity of plating against tin whisker growth |
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Suitable for processing on automatic SMD assembly systems in large-scale applications |
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Support lead (Pb)-free soldering |
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| Applications: |
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Precise temperature measurements in automotive electronics, industrial electronics, telecommunication systems, and medical equipment |
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Suitable for processing on automatic SMD assembly systems in large-scale applications using wave, reflow, or vapor phase processes |
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| Characteristics: |
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Remains stable for a long time over a wide temperature range thanks to a highly controlled platinum thin film manufacturing process |
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Terminations are pure tin on nickel plating, and the immunity of the plating against tin whisker growth has been proven under extensive testing |
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Devices comply with the CEFIC-EECA-EICTA list of legal restrictions on hazardous substances and are tested in accordance with IEC 60751 and IEC 60068 series |
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