Bluetooth™ Front-end IC T7024

ICs, Development Boards (PSSO20 and QFN20), and a Long Range RF-Module

The T7024 is a single supply front-end IC especially designed for applications in the 2.4 GHz to 2.5 GHz frequency band. The front end consists of a Power Amplifier (PA), a Low-Noise Amplifier (LNA) and a switch driver for a PIN diode antenna switch.
The T7024 is compliant with TDMA systems such as Bluetooth™, WDCT.
Since the LNA and the PA can be operated at the same time, the T7024 is also open to other modulation systems when the antenna switch is not needed.

The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. T7024 Datasheet
Digi-Key Part Number	Atmel Part Number	Mounting Type	Package Name	Type	Frequency Min / Max
T7024-TRQYTR-ND	T7024-TRQY	SMD	20-SSOP	Bluetooth Front End	2.400 / 2.500 GHz
T7024-TRQYCT-ND
T7024-TRQYDKR-ND
T7024-PGQM80TR-ND	T7024-PGQM80	SMD	20-QFN	Bluetooth Front End	2.400 / 2.500 GHz
T7024-PGQM80CT-ND
T7024-PGQM80DKR-ND

Digi-Key Part Numbers: TR-ND = Tape & Reel; CT-ND = Cut Tape; DKR-ND = Custom Qty with Leader/Trailer

DEMOBOARD-T7024PGM-ND

Demoboard Bluetooth Power Amplifier (PSSO20 and QFN20 packages)

The DEMOBOARD-T7024-PGM is the typical application board that supports circuitry of the T7024 in a PSSO20 package. The reference design consists of a four-layer FR4 printed circuit board. The upper layer contains the RF lines and most DC connections. The internal layers are used for ground connections. Some DC connections are made on the backside of the application board. The RF lines for the LNA and PA inputs as well as outputs are 50 Ω lines and a width of 1mm and a distance of 0.5 mm to the ground layer. A Gerber file with information of the printed circuit is available on request.

The application board consists of 4 layers.

1. Top layer: RF-signals, 35 µm Cu. Spacing: 490 µm FRY
2. Second layer: GND, 35 µm Cu. Spacing: 550 µm FRY
3. Third layer: GND (optional) 35 µm Cu. Spacing: 490 µm FRY
4. Bottom layer: DC connections (optional), 35 µm Cu



	PSSO20	Board Layout, Board Schematic

	QFN20	Board Layout, Board Schematic

ATR2406-DEV-BOARD2-ND

Complete Long Range RF-Module


The ATR2406-DEV-BOARD2 is a complete long range RF-Module with the low-IF Transceiver ATR2406 and the PA-LNA frontend IC T7024. It is designed to make it very easy and convenient for the user to evaluate the RF IC performance and develop custom specific applications. The RF-Module is available seperately. It consists of 1 complete "solder-on" RF-Module (Reference Design), 1 Interfaceboard incl. SMA connector, 1 CD-ROM with sample firmware and Manufacture Data (Gerber Files) The RF transceiver offers a clock recovery function on-chip.